Course detail
Physical Principles of the Semiconductor Technology
FSI-TP0 Acad. year: 2025/2026 Winter semester
Individual steps in semiconductors production and device manufacturing – physics and chemistry models
Language of instruction
Czech
Number of ECTS credits
2
Supervisor
Department
Entry knowledge
Solid State Physics, chemistry
Rules for evaluation and completion of the course
Colloquium and a brief final report on the problem solution.
Aims
The main purpose of the lectures given by experts from industry is to provide the students ability to:
- list and describe individual steps in semiconductors production and device manufacturing
- find how basic physics is applied in semiconductors production manufaturing
- understand how industrial processes are optimized using physics and chemistry models
The course provides knowledge of processes in semiconductors production
The study programmes with the given course
Programme BPC-NCP: Chip Design and Modern Semiconductor Technologies, Bachelor's, compulsory
Programme N-FIN-P: Physical Engineering and Nanotechnology, Master's, elective
Programme B-FIN-P: Physical Engineering and Nanotechnology, Bachelor's, elective
Type of course unit
Lecture
39 hours, optionally
Syllabus
The following topics will be covered:
Silicon wafer manufacturing technology overview
Silicon single crystal growth
Defects in silicon
Surface analysis in semiconductor manufacturing
Polishing and cleaning of silicon wafers
Silicon device fabrication overview
Silicon oxidation and impurity diffusion
Chemical vapor phase deposition and plasma assisted layer deposition
Photolithography, silicon oxide etching
Dry etching, metal sputtering
Applied statistics in industry