Publication detail
Analysis of GaN Ultrathin Films grown by Direct Ion Beam Deposition
VOBORNÝ, S. MACH, J. POTOČEK, M. KOSTELNÍK, P. ČECHAL, J. BÁBOR, P. SPOUSTA, J. ŠIKOLA, T.
Czech title
Analýza ultratenkých vrstev GaN připravených metodou přímé depozice inotovým svazkem
English title
Analysis of GaN Ultrathin Films grown by Direct Ion Beam Deposition
Type
presentation
Language
en
Original abstract
In the contribution, the in-situ analysis of GaN ultrathin films grown on Si (111) by a low-temperature technique combining a hyperthermal nitrogen ion beam and gallium atomic beam under UHV conditions will be presented. Low energy ions from the beam (10 -100 eV) provides an extra kinetic energy on the surface, thus substituting a need for higher temperatures typical for other techniques (e.g. MOCVD). Additionally, this extra energy is responsible for a subsurface growth improving the layer adhesion. Deposition experiments were carried out at different operation parameters. The dependence on ion-impact energy, substrate temperature and ion-to-atom arrival ratio was examined. The ultrathin films were analyzed using XPS to find their composition, their structure- and morphology analyses were carried out by LEED and AFM, respectively. Compared to our previous experiments, the deposition setup was improved by modification of a gas distribution system and by application of nitrogen of higher purity (6-9). The former allowed us to bake up the whole vacuum apparatus including the high-energy ion source chamber and transport optics. It resulted in the higher purity of ion beam and, hence, in better conditions for deposition of clean oxygen-free GaN films.
Czech abstract
Příspěvek se zabývá tvorbou a analýzou ultratenkých vrstev GaN připravených metodou přímé depozice.
English abstract
In the contribution, the in-situ analysis of GaN ultrathin films grown on Si (111) by a low-temperature technique combining a hyperthermal nitrogen ion beam and gallium atomic beam under UHV conditions will be presented. Low energy ions from the beam (10 -100 eV) provides an extra kinetic energy on the surface, thus substituting a need for higher temperatures typical for other techniques (e.g. MOCVD). Additionally, this extra energy is responsible for a subsurface growth improving the layer adhesion. Deposition experiments were carried out at different operation parameters. The dependence on ion-impact energy, substrate temperature and ion-to-atom arrival ratio was examined. The ultrathin films were analyzed using XPS to find their composition, their structure- and morphology analyses were carried out by LEED and AFM, respectively. Compared to our previous experiments, the deposition setup was improved by modification of a gas distribution system and by application of nitrogen of higher purity (6-9). The former allowed us to bake up the whole vacuum apparatus including the high-energy ion source chamber and transport optics. It resulted in the higher purity of ion beam and, hence, in better conditions for deposition of clean oxygen-free GaN films.
Keywords in English
Gallium; GaN; direct deposition
Released
25.09.2005
Location
Vienna
Edition number
1
Pages from–to
117–117
Pages count
1