Publication detail

Microstructure and mechanical properties of electrodeposited nickel and its particle-reinforced nanocomposite

CIHLÁŘOVÁ, P. ŠVEJCAR, J. SKLENIČKA, V.

Czech title

Mikrostruktura a vlastnosti Ni připraveného elektrodeposicí a nanokompositu na jeho bázi

English title

Microstructure and mechanical properties of electrodeposited nickel and its particle-reinforced nanocomposite

Type

journal article - other

Language

en

Original abstract

The results have shown that the creep resistance of the nickel nanocomposite reinforced with nanosized SiO2 particles is higher in comparision with non-reinforced Ni.The mechanism responsible for creep behaviour ic dislocation creep at 293 K ,controled by grain boundary sliding at higher temperatures.

Czech abstract

Bylo prokázáno,že odolnost proti creepu je v případě Ni zpevněného nanočásticemi SiO2 vyšší,než u Ni bez částic.Mechanizmem zodpovědným za creepové chování je za teploty 293K dislokační creep,za vyšších teplot dislokační creep řízený pokluzy po hranicích zrn

English abstract

The results have shown that the creep resistance of the nickel nanocomposite reinforced with nanosized SiO2 particles is higher in comparision with non-reinforced Ni.The mechanism responsible for creep behaviour ic dislocation creep at 293 K ,controled by grain boundary sliding at higher temperatures.

Keywords in Czech

nanokomposit,částice SiO2,elektrodeposice,mechanické vlastnosti

Keywords in English

nanomaterial,particles SiO2,electrodeposition,nanocomposit,mechanical properties

RIV year

2008

Released

06.12.2007

Publisher

Trans Tech Publications Ltd

Location

Switzerland

ISSN

0255-5476

Journal

Materials Science Forum

Volume

567-568

Number

567-568

Pages from–to

205–208

Pages count

4

BIBTEX


@article{BUT45168,
  author="Petra {Cihlářová} and Jiří {Švejcar} and Václav {Sklenička},
  title="Microstructure and mechanical properties of electrodeposited nickel and its particle-reinforced nanocomposite",
  journal="Materials Science Forum",
  year="2007",
  volume="567-568",
  number="567-568",
  month="December",
  pages="205--208",
  publisher="Trans Tech Publications Ltd",
  address="Switzerland",
  issn="0255-5476"
}