Publication detail
Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition
KUNZ, L. LUKÁŠ, P. PANTĚLEJEV, L. MAN, O.
Czech title
Mikrostrukturní stabilita ultra-jemnozrnné mědi při únavové a teplotní expozici.
English title
Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition
Type
journal article - other
Language
en
Original abstract
Effect of cyclic loading and thermal exposition on microstructure of bulk ultrafinegrained Cu prepared by equal channel angular pressing was experimentally investigated by means of electron backscattering diffraction and by transmission electron microscopy. Stability of the microstructure under stress-controlled cyclic loading with a tensile mean stress of 200 MPa was shown to be high. Neither dynamic grain coarsening nor development of bimodal microstructure was observed. However, annealing at 250 C for 30 min resulted in formation of bimodal microstructure. Consequently, fatigue strength of annealed specimens was low.
Czech abstract
V práci byl experimentálně zkoumán vliv cyklického zatížení a teplotní expozice na mikrostrukturu ultra-jemnozrnné Cu připravené metodou ECAP s využitím metody EBSD a TEM. Bylo zjištěno, že v průběhu únavového zatěžování se středním napětím 200 MPa je mikrostruktura vysoce stabilní, nebylo pozorováno hrubnutí zrna ani vznik bimodální struktury. Při zíhání na teplotě 200 C po dobu 30 minut docházelo ke vzniku bimodální mikrostruktury, současně došlo ke snížení únavové pevnosti.
English abstract
Effect of cyclic loading and thermal exposition on microstructure of bulk ultrafinegrained Cu prepared by equal channel angular pressing was experimentally investigated by means of electron backscattering diffraction and by transmission electron microscopy. Stability of the microstructure under stress-controlled cyclic loading with a tensile mean stress of 200 MPa was shown to be high. Neither dynamic grain coarsening nor development of bimodal microstructure was observed. However, annealing at 250 C for 30 min resulted in formation of bimodal microstructure. Consequently, fatigue strength of annealed specimens was low.
Keywords in Czech
bezkontrakční úhlové protlačování (ECAP), únava, mikrostrukturní stabilita, ultra-jemnozrnná měď
Keywords in English
equal channel angular pressing, fatigue, stability of microstructure, ultrafine-grained copper
RIV year
2011
Released
01.12.2011
Publisher
Blackwell Publishing Ltd
Location
New Delhi
ISSN
0039-2103
Volume
47
Number
6
Pages from–to
476–482
Pages count
7
BIBTEX
@article{BUT48103,
author="Ludvík {Kunz} and Petr {Lukáš} and Libor {Pantělejev} and Ondřej {Man},
title="Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition",
year="2011",
volume="47",
number="6",
month="December",
pages="476--482",
publisher="Blackwell Publishing Ltd",
address="New Delhi",
issn="0039-2103"
}