Publication detail

Microstructural stability of ultrafine grained copper at elevated temperature

PANTĚLEJEV, L. MAN, O. KUNZ, L.

Czech title

Microstructural stability of ultrafine grained copper at elevated temperature

English title

Microstructural stability of ultrafine grained copper at elevated temperature

Type

journal article - other

Language

cs

Original abstract

Thermal stability of ultrafine grained (UFG) structure of 99.9 % pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at temperature range from 180 centigrade to 300 centigrade in a tube furnace under argon as a protecting gas. The dwell times were in the range from 10 min to 300 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the changes of UFG structure. More advanced analysis of the EBSD results based on kernel average misorientation (KAM) parameter was performed.

Czech abstract

Thermal stability of ultrafine grained (UFG) structure of 99.9 % pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at temperature range from 180 centigrade to 300 centigrade in a tube furnace under argon as a protecting gas. The dwell times were in the range from 10 min to 300 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the changes of UFG structure. More advanced analysis of the EBSD results based on kernel average misorientation (KAM) parameter was performed.

English abstract

Thermal stability of ultrafine grained (UFG) structure of 99.9 % pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at temperature range from 180 centigrade to 300 centigrade in a tube furnace under argon as a protecting gas. The dwell times were in the range from 10 min to 300 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the changes of UFG structure. More advanced analysis of the EBSD results based on kernel average misorientation (KAM) parameter was performed.

Keywords in Czech

ultrafine grained microstructure, copper, microstructural stability, electron backscattering diffraction (EBSD)

Keywords in English

ultrafine grained microstructure, copper, microstructural stability, electron backscattering diffraction (EBSD)

RIV year

2011

Released

13.09.2011

Publisher

Technická universita Košice

Location

Košice

ISSN

1335-1532

Journal

Acta Metallurgica Slovaca

Volume

17

Number

3

Pages from–to

158–162

Pages count

5

BIBTEX


@article{BUT74820,
  author="Libor {Pantělejev} and Ondřej {Man} and Ludvík {Kunz},
  title="Microstructural stability of ultrafine grained copper at elevated temperature",
  journal="Acta Metallurgica Slovaca",
  year="2011",
  volume="17",
  number="3",
  month="September",
  pages="158--162",
  publisher="Technická universita Košice",
  address="Košice",
  issn="1335-1532"
}