Detail publikace
Microstructural stability of ultrafine grained copper at elevated temperature
PANTĚLEJEV, L. MAN, O. KUNZ, L.
Český název
Microstructural stability of ultrafine grained copper at elevated temperature
Anglický název
Microstructural stability of ultrafine grained copper at elevated temperature
Typ
článek v časopise - ostatní, Jost
Jazyk
cs
Originální abstrakt
Thermal stability of ultrafine grained (UFG) structure of 99.9 % pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at temperature range from 180 centigrade to 300 centigrade in a tube furnace under argon as a protecting gas. The dwell times were in the range from 10 min to 300 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the changes of UFG structure. More advanced analysis of the EBSD results based on kernel average misorientation (KAM) parameter was performed.
Český abstrakt
Thermal stability of ultrafine grained (UFG) structure of 99.9 % pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at temperature range from 180 centigrade to 300 centigrade in a tube furnace under argon as a protecting gas. The dwell times were in the range from 10 min to 300 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the changes of UFG structure. More advanced analysis of the EBSD results based on kernel average misorientation (KAM) parameter was performed.
Anglický abstrakt
Thermal stability of ultrafine grained (UFG) structure of 99.9 % pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at temperature range from 180 centigrade to 300 centigrade in a tube furnace under argon as a protecting gas. The dwell times were in the range from 10 min to 300 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the changes of UFG structure. More advanced analysis of the EBSD results based on kernel average misorientation (KAM) parameter was performed.
Klíčová slova česky
ultrafine grained microstructure, copper, microstructural stability, electron backscattering diffraction (EBSD)
Klíčová slova anglicky
ultrafine grained microstructure, copper, microstructural stability, electron backscattering diffraction (EBSD)
Rok RIV
2011
Vydáno
13.09.2011
Nakladatel
Technická universita Košice
Místo
Košice
ISSN
1335-1532
Časopis
Acta Metallurgica Slovaca
Ročník
17
Číslo
3
Strany od–do
158–162
Počet stran
5
BIBTEX
@article{BUT74820,
author="Libor {Pantělejev} and Ondřej {Man} and Ludvík {Kunz},
title="Microstructural stability of ultrafine grained copper at elevated temperature",
journal="Acta Metallurgica Slovaca",
year="2011",
volume="17",
number="3",
month="September",
pages="158--162",
publisher="Technická universita Košice",
address="Košice",
issn="1335-1532"
}