Detail publikace
Tepelná vodivost slitiny mědi Cu7.2Ni1.8Si1Cr vyrovené metodou SLM a možnost výroby tenkých stěn
MAŠEK, J. KOUTNÝ, D. POPELA, R.
Český název
Tepelná vodivost slitiny mědi Cu7.2Ni1.8Si1Cr vyrovené metodou SLM a možnost výroby tenkých stěn
Anglický název
Thermal conductivity of Cu7.2Ni1.8Si1Cr Copper alloy produced via SLM and ability of thin-wall structure fabrication
Typ
článek ve sborníku ve WoS nebo Scopus
Jazyk
en
Originální abstrakt
Selective Laser Melting (SLM) as part of the Additive manufacturing industry is a metal printing technology that is considered promising to address the thermal integrity defects of a Heat Switch – the space technology currently under development. However, no thermal conductivity data of SLMed copper alloy Cu7.2Ni1.8Si1Cr are freely available. Therefore, three parts were fabricated and tested in an experimental thermo-vacuum chamber to reveal the material thermal conductivity. The samples analogous to the Heat Switch components were: a disk with inner holes and two cylinders with thin-wall web of 0.325 mm and 1.625 mm. Based on the previous experience with the copper alloy, fabrication was successfully processed with up to 5 % dimensional accuracy according to CAD model. The thermal conductivity evaluation process was improved by the implementation of heat transfer by radiation and the calculated thermal conductivity of SLMed Cu7.2Ni1.8Si1Cr was 3.4 times lower than the value of bulk material AMPCOLOY 944 with a similar chemical composition.
Anglický abstrakt
Selective Laser Melting (SLM) as part of the Additive manufacturing industry is a metal printing technology that is considered promising to address the thermal integrity defects of a Heat Switch – the space technology currently under development. However, no thermal conductivity data of SLMed copper alloy Cu7.2Ni1.8Si1Cr are freely available. Therefore, three parts were fabricated and tested in an experimental thermo-vacuum chamber to reveal the material thermal conductivity. The samples analogous to the Heat Switch components were: a disk with inner holes and two cylinders with thin-wall web of 0.325 mm and 1.625 mm. Based on the previous experience with the copper alloy, fabrication was successfully processed with up to 5 % dimensional accuracy according to CAD model. The thermal conductivity evaluation process was improved by the implementation of heat transfer by radiation and the calculated thermal conductivity of SLMed Cu7.2Ni1.8Si1Cr was 3.4 times lower than the value of bulk material AMPCOLOY 944 with a similar chemical composition.
Klíčová slova česky
Aditivní výroba, výrobní přesnost metody SLM, slitina mědi Cu7.2Ni1.8Si1Cr, struktura tenkých stěn, testování tepelné vodivosti
Klíčová slova anglicky
Additive manufacturing, SLM production accuracy, Copper alloy Cu7.2Ni1.8Si1Cr, Thin-wall structures, Thermal conductivity testing
Vydáno
20.12.2018
Nakladatel
Brno University of Technology
Místo
READ 2018, Brno, ČR
ISBN
978-80-214-5696-9
Kniha
13th Research and Education in Aircraft Design Conference
Strany od–do
119–129
Počet stran
11
BIBTEX
@inproceedings{BUT151321,
author="Jakub {Mašek} and Daniel {Koutný} and Robert {Popela},
title="Thermal conductivity of Cu7.2Ni1.8Si1Cr Copper alloy produced via SLM and ability of thin-wall structure fabrication",
booktitle="13th Research and Education in Aircraft Design Conference
",
year="2018",
month="December",
pages="119--129",
publisher="Brno University of Technology",
address="READ 2018, Brno, ČR",
isbn="978-80-214-5696-9"
}